GENEVA, Oct. 30 -- NOKIA TECHNOLOGIES OY filed a patent application (EP2026/060286) for “METHODS, SYSTEMS, AND APPARATUSES FOR PROVIDING AN ENHANCED PHYSICAL RANDOM ACCESS CHANNEL”. With publication n... और पढ़ें
GENEVA, Oct. 30 -- GKN AEROSPACE SWEDEN AB filed a patent application (EP2026/060188) for “TURBINE OUTER CASE INDENTATION”. With publication no. WO/2026/223987, here are the other details related to t... और पढ़ें
GENEVA, Oct. 30 -- ERSA GMBH & CO. KG filed a patent application (EP2026/060234) for “SOLDERING SYSTEM HAVING A DRIVEN TRANSFER WHEEL AND TRANSFER DEVICE”. With publication no. WO/2026/223988, here ar... और पढ़ें
GENEVA, Oct. 30 -- COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN filed a patent application (EP2026/060256) for “[INFLATABLE ELEMENT AND METHOD FOR MANUFACTURING AN INFLATABLE ELEMENT]”. With publica... और पढ़ें
GENEVA, Oct. 30 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (EP2026/060158) for “HEAT DISSIPATING METAL-CORE-ORGANIC-SUBSTRATE”. With publication no. WO/2026/223984, here... और पढ़ें
GENEVA, Oct. 30 -- AMS-OSRAM INTERNATIONAL GMBH filed a patent application (EP2026/060173) for “ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT”. With publication no. WO/2026/223... और पढ़ें
GENEVA, Oct. 30 -- SIGNIFY HOLDING B.V. filed a patent application (EP2026/060180) for “A LED STRIP FILAMENT COMPRISING A PLURALITY OF ALTERNATING STRIP AND FILAMENT PORTIONS”. With publication no. WO... और पढ़ें
GENEVA, Oct. 30 -- DEUTSCHES ZENTRUM FÜR LUFT- UND RAUMFAHRT E.V. filed a patent application (EP2026/060110) for “METHOD AND SYSTEM FOR THE REAL-TIME PHASE SYNCHRONIZATION OF AN SAR SYSTEM”. With publ... और पढ़ें
GENEVA, Oct. 30 -- ROBERT BOSCH GMBH filed a patent application (EP2026/060118) for “LOUDSPEAKER SYSTEM COMPRISING A FIRST LOUDSPEAKER UNIT, A SECOND LOUDSPEAKER UNIT AND A MODULATOR UNIT”. With publi... और पढ़ें
GENEVA, Oct. 30 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (EP2026/060156) for “POWER DELIVERY AND COOLING OF 3D STACKED MULTI-CHIPLET MODULES”. With publication no. WO/... और पढ़ें